XFigures
Figure 2-1 Hicom 150 E OfficePro Rel 1.1 "Extended Line"/Rel2.2 System Env.
Figure 2-2 HDLC and PCM Connections for Hicom 150 E OfficePro Rel. 1.1 "Extended Line"/Rel 2.2
Figure 2-3 Hicom 150 E OfficePro Rel. 1.1 "Extended Line"/Rel 2.2 with Expansion Cabinets and Main Distribution Frame Unit (MDFU-E)
Figure 2-4 Hicom 150 E OfficePro Rel 1.1 "Extended Line"/Rel 2.2-Slots
Figure 2-5 Connection of UPSM and Battery Packs
Figure 2-6 Connection of UPSM and External Charging Rectifier
with Battery
Figure 2-7 Hicom 150 E Cabinet-Heat Dissipation and Power Consumption
Figure 2-8 OfficePro Rel 1.0/2.0 System Environment (World)
Figure 2-9 OfficePro Rel 1.0/2.0/2.2 System Environment (U.S. Version)
Figure 2-10 OfficePro with Expansion Cabinets and MDF
Figure 2-11 OfficePro Rel 1.0/2.0 (and Rel 2.2 in the U.S.)-Slots
Figure 2-12 Cabinet Without UPSI-Power Consumption and Heat Dissipation
Figure 2-13 Cabinet with UPSI-Power Consumption and Heat Dissipation (Normal Mode) (Not for U.S.)
Figure 2-14 Cabinet with UPSI-Power Consumption and Heat Dissipation (During Power Failure) (Not for U.S.)
Figure 2-15 USVI with the Hicom 150 E Office System (Not for U.S.)
Figure 2-16 Connecting Two Battery Sets in Parallel (Not for U.S.)
Figure 2-17 Connecting an External Battery to Hicom 150 E Office (Not for U.S.)
Figure 2-18 OfficePro-Permissible Cabinet Arrangements
Figure 2-19 OfficeCom System Environment (U.S. Version)
Figure 2-20 Hicom 150 E OfficeCom Rel 2.0 System Environment (World)
Figure 2-21 OfficeCom Rel 2.0 System Environment (U.S. Version)
Figure 2-22 OfficeCom Rel 1.0-Dimensions and Slots
Figure 2-23 OfficeCom Rel 2.0 and Later-Dimensions and Slots
Figure 2-24 Power Consumption and Heat Dissipation with PSUC or USVC
Figure 2-25 Power Consumption and Heat Dissipation with PSUC or USVC
Figure 2-26 OfficePoint System Environment (World Version)
Figure 2-27 OfficePoint System Environment (U.S. Version)
Figure 2-28 OfficePoint-Dimensions and Slots
Figure 2-29 Power Consumption and Heat Dissipation with PSUF or USVF
Figure 2-30 OfficeOne System Environment
Figure 2-31 OfficeOne-Dimensions
Figure 2-32 OfficeOne-Power Consumption and Heat Dissipation
Figure 2-33 Hicom Cordless Em V 2.2 System Environment (Not for U.S.)
Figure 2-34 Equipment for Remote Service
Figure 3-1 Sample LCR Flow Diagram (Not for U.S.)
Figure 3-2 LCR flow diagram
Figure 3-3 Sample LCR Flow Diagram (for U.S. Only)
Figure 3-4 Compressed Output Format for Call Details
Figure 3-5 Long Output Format for Call Data
Figure 3-6 Host Link Interface, converter principle
Figure 4-1 The User Interface for the optiset E Telephone with Display
Figure 4-2 optiset E Add-on Devices: Possible Configurations (Not for U.S.)
Figure 4-3 Display of an ENB Entry (Example)
Figure 4-4 Connection of a Braille Console to a Hicom Attendant B
Figure 4-5 The Hicom Attendant P is connected using a UP0/E card
Figure 2-1 Hicom 150 E OfficePro Rel 1.1 "Extended Line"/Rel2.2 System Env.
Figure 2-2 HDLC and PCM Connections for Hicom 150 E OfficePro
Rel. 1.1 "Extended Line"/Rel 2.2
Figure 2-3 Hicom 150 E OfficePro Rel. 1.1 "Extended Line"/Rel 2.2 with
Cabinets and Main Distribution Frame Unit (MDFU-E)
Figure 2-4 Hicom 150 E OfficePro Rel 1.1 "Extended Line"/Rel 2.2-Slots
Figure 2-5 Connection of UPSM and Battery Packs
Figure 2-6 Connection of UPSM and External Charging Rectifier
with Battery
Figure 2-7 Hicom 150 E Cabinet-Heat Dissipation and Power Consumption
Figure 2-8 OfficePro Rel 1.0/2.0 System Environment (World)
Figure 2-9 OfficePro Rel 1.0/2.0/2.2 System Environment (U.S. Version)
Figure 2-10 OfficePro with Expansion Cabinets and MDF
Figure 2-11 OfficePro Rel 1.0/2.0 (and Rel 2.2 in the U.S.)-Slots
Figure 2-12 Cabinet Without UPSI-Power Consumption and Heat Dissipation
Figure 2-13 Cabinet with UPSI-Power Consumption and Heat Dissipation
(Normal Mode) (Not for U.S.)
Figure 2-14 Cabinet with UPSI-Power Consumption and Heat Dissipation
(During Powr Failure) (Not for U.S.)
Figure 2-15 USVI with the Hicom 150 E Office System (Not for U.S.)
Figure 2-16 Connecting Two Battery Sets in Parallel (Not for U.S.)
Figure 2-17 Connecting an External Battery to Hicom 150 E Office (Not for U.S.)
Figure 2-18 OfficePro-Permissible Cabinet Arrangements
Figure 2-19 OfficeCom System Environment (U.S. Version)
Figure 2-20 Hicom 150 E OfficeCom Rel 2.0 System Environment (World)
Figure 2-21 OfficeCom Rel 2.0 System Environment (U.S. Version)
Figure 2-22 OfficeCom Rel 1.0-Dimensions and Slots
Figure 2-23 OfficeCom Rel 2.0 and Later-Dimensions and Slots
Figure 2-24 Power Consumption and Heat Dissipation with PSUC or USVC
Figure 2-25 Power Consumption and Heat Dissipation with PSUC or USVC
Figure 2-26 OfficePoint System Environment (World Version)
Figure 2-27 OfficePoint System Environment (U.S. Version)
Figure 2-28 OfficePoint-Dimensions and Slots
Figure 2-29 Power Consumption and Heat Dissipation with PSUF or USVF
Figure 2-30 OfficeOne System Environment
Figure 2-31 OfficeOne-Dimensions
Figure 2-32 OfficeOne-Power Consumption and Heat Dissipation
Figure 2-33 Hicom Cordless Em V 2.2 System Environment (Not for U.S.)
Figure 2-34 Equipment for Remote Service
Figure 3-1 Sample LCR Flow Diagram (Not for U.S.)
Figure 3-2 LCR flow diagram
Figure 3-3 Sample LCR Flow Diagram (for U.S. Only)
Figure 3-4 Compressed Output Format for Call Details
Figure 3-5 Long Output Format for Call Data
Figure 3-6 Host Link Interface, converter principle
Figure 4-1 The User Interface for the optiset E Telephone with Display
Figure 4-2 optiset E Add-on Devices: Possible Configurations (Not for U.S.)
Figure 4-3 Display of an ENB Entry (Example)
Figure 4-4 Connection of a Braille Console to a Hicom Attendant B
Figure 4-5 The Hicom Attendant P is connected using a UP0/E card
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© Siemens AG, München, 1999
Hicom 150 E Office Rel. 1.0-2.2 System Description, 1, 1999-06-18
Siemens Part No.: P31003-M1542-X100-4-7618
Conversion Date: 1999-06-18